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        2.  
           
           
           
          LC(Line Card)
                  - 最高层数: 32层
                  - 高密度设计 High Density Design): 内层线宽/线距 3mil / 3mil (75um / 75um)
                  - 背钻工艺: Backdrilling, Counter Bore, Depth Controlled Drilling; 单面背钻, 双面背钻, 多种深度
                  - 阻抗控制: Controlled Impedance
                  - 高密度互连 / 激光孔: HDI (High Density Interconnection) / Laser Vias; 1+N+1, 2+N+2
                  - 盲/埋孔板: Blind / Buried Vias
                  - 树脂填孔(堵孔/塞孔) + 盖帽电镀铜工艺: POFV (Plating Over Filled Vias)
                  - 厚铜板: Heavy Copper, 3~12OZ
                  - 阶梯槽 (凹槽)设计: Cavity
                  - 埋入式被动组件: 埋电容板 (Buried Capacitor), 埋电阻板 (Buried Resistor)
                  - 低/中/高玻璃态转变温度板材: Normal / Medium / High Tg Material (Laminate & Prepreg)
                  - 高速低损耗板材: High Speed (Low DK), Low Loss (Low Df) Material (Laminate & Prepreg)
                  - 无卤素环保板材: Halogen-free Material (Laminate & Prepreg)
                  - 无卤素防焊(据焊)油墨: Halogen-free Soldermask ink
                  - 因应无铅组装之材料与工艺: Lead-free assembly compliant material and process
                  - 抗离子迁移之材料与工艺: Anti-CAF material and process
                  - 广泛应用于网络, 通讯, 办公, 消费, 医疗, 航空航天, 汽车等工业设备



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