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          黄石厂简介

          1.Geographical location Hubei(HuangShi)

          2.Site Overview

          3.Function of Quality Assurance

          4.Capability

          Item Technology and Capability
          Layers 2~14 layers
          Board thickness 16mil~126mil(0.4~3.2mm)
          working panel size.(Max) 610*712mm (24*28 inch)
          Material Mid-Tg Phenolic & HF, High-TgPhenolic, FR4 & HF FR4,Mid Loss
          core dielectric thickness (Min) 3mil(75μm)
          Line width/spacing Inner layer:3mil/3mil(H OZ);Outer layer:3.5mil/3.5mil(Copperfoil H OZ)
          Inner layer copper thickness(Max) 5 OZ
          Drilling Hole Diameter (Min) 0.20mm
          Aspect ratio (DHS) (Max) 12:1
          Outer Layer Process Pattern plating
          Surface Metal Finish ENIG,OSP,HASL(leaded),GoldFinger,ENIG+OSP,OSP+GoldFinger
          Special Process Back Drilling,POFV,Buried Vias,Segmented Gold Finger ,etc

          5.Technology Support

          沪士电子股份有限公司    版权所有      
          苏ICP备10211191号
          平安彩票下载

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